ML PCB manufacturing – Pattern Plating, Solder mask, Surface finish
Pattern plating Pattern plating is a DC electro plating process. The drilled holes, which are made conducting in the PTH process, are built up to 25 […]
Author: Dhiraj
Multilayer PCB Manufacturing Process – Layup, Drilling
Lay-up Inner cores and prepregs are stacked together in an order as per the ML construction. The operation of creating the stack is called ‘Layup’. Need […]
Multilayer Pcb Manufacturing Process -Lamination, Etching, Striping
Core – Base Material Shearing The king size boards (36” X 48”, 42” X48”) are sheared in to the production required (standard) size. Pre-cut panels are […]
Multilayer PCB manufacturing process flow And Materials
Initial Processes before manufacturing of PCB Multi-Layer Production Flow-chart PRODUCTION PROCESSES PRODUCTION PROCESSES Materials for Multilayer PCB Fabrication Major raw materials which goes into a fabrication […]
Fibre weave effect in PCB
What is the fibre weave effect? The fibre weave effect is a phenomenon that occurs when manufacturing printed circuit boards (PCBs). It occurs when the fibres […]
