What are CAF issues and how to address them?
CAF Failures Conductive Anodic Filament CAF –> Formation of Solid Cu Filament between different nets within PCB at different potentials –>follows a glass weave pathway internally […]
Author: Dhiraj
PCB Stack-up Rules
What Is PCB Layer Stackup? Stackup, as the name implies, refers to the collection of copper and insulator layers that make up a PCB before the […]
Optical PCB
Optical Printed Circuit Board Technology The next generation of internet switches and high-end computers are expected to process data at Tbit/s aggregate speeds. As a result, […]
PCB Back Drilling
Back Drilling in PCB PCB Back drilling, also known as controlled depth drilling, is a technique for removing stubs from plated through-holes or vias on high-speed […]
PCB Panelization methods
What is Panelization? PCB panelization is a fabrication technique that allows smaller PCBs to be produced and joined together as a single array, making it easier […]
