Aluminum and copper Heat sink PCB
To operate efficiently and ensure reliability, heat must be removed from heat generating power components. As a result of faster speeds, reduced format, and more devices
Author: Dhiraj
PCB Thermal Management – Thermal Via
To operate efficiently and ensure reliability, heat must be removed from heat generating power components.
As a result of faster speeds, reduced format, and more devices being populated on PCB’s , more heat is being generated that must be removed for efficient operation.
Engineered Thermal Solutions(ETS)
Customer Challenges For Thermal Management Components mounted on PCB surfaces are overheating System density is ever increasing Engineers are forced to place more power in less […]
Advanced Photonics Packaging
Next generation Integrated Coherent Transmitter & Receiver Optical Sub-Assembly (IC-TROSA) are targeting 100G+ Increased demand for high speed bandwidth. Increased component density.
Substrate-like PCB and Its Applications
What does Substrate-like PCB mean? The next generation of high-density PCB, known as substrate-like PCB (SLP PCB), calls for trace/spacing that is equal to or less […]
