HDI(High-Density Interconnect PCBs)

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HDI PCB (High-Density Interconnect PCBs)

HDI PCB is helpful and one of the latest technologies available to increase the functionality of PCB using the same or less amount of area. This advanced technology in PCB has driven the miniaturization of components and semiconductor packages that supports advanced features in new products. This includes touch screen computing 5G network communications and Military Applications, Automotive, Medical PCB Manufacturing.

HDI Printed circuit Boards are characterized by high-density attributes fine line and high-performance thin materials including laser lines. This increased density enables more functions per unit area. HDI PCB have multiple layers of copper filled stacked microvias and (Advanced High-Density Interconnect PCBs) which creates a structure that enables even more complex interconnections. HDI PCBs complex structures provide the necessary routing solutions for today’s large pin-count chips utilized in mobile devices and other high technology products.

It is the one which cannot fail under extreme environment and any critical applications this high-reliability PCBs are increasingly demanding the application today that required the PCB that cannot fail under use. Conventional PCB can be any layer count, but rely on conventional drilling and plating technology.

Our Capability includes:

  • Multilayer up to 60+ layers.
  • Wide range of laminate options including high temperature low Loss and Lead-free laminates.
  • Mixed Dielectric and hybrid constructions.
  • Embedded coin, or metal core and metal backed Multilayer boards.
  • Panel size up to “30×55”.

Advanced Capabilities: Microvias

A laser-drilled microvias has a drilled diameter as small as 0.004″ (100µm), which is optically aligned in a pad diameter as small as 0.008″ (200µm), allowing additional routing density. Microvias can be via-in-pad (for direct component mounting), offset, staggered, or stacked, non-conductive filled, and copper-plated over the top or solid copper filled or plated. Microvias add values when routing out of fine pitch BGA such as 0.8 mm pitch devices and below.

Additionally, microvias add values when routing out of a 0.5 mm pitch device where staggered microvias can be used. However, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device requires stacked microvias using an inverted pyramid routing technique.

We have years of experience with HDI PCB products and was a pioneer of second-generation microvias or stacked microvias. Stacked microvia technology with solid copper stacked microvias enables rout-out solutions for very high speed and micro BGA. Cerra Systems offers an entire family of microvia technology solutions for your next-generation products.

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