HDI PCB (High-Density Interconnect PCBs)
HDI PCB is helpful and one of the latest technologies available to increase the functionality of PCB using the same or less amount of area. This advanced technology in PCB has driven the miniaturization of components and semiconductor packages that supports advanced features in new products. This includes touch screen computing 5G network communications and Military Applications, Automotive, Medical PCB Manufacturing.
HDI Printed circuit Boards are characterized by high-density attributes fine line and high-performance thin materials including laser lines. This increased density enables more functions per unit area. HDI PCB have multiple layers of copper filled stacked microvias and (Advanced High-Density Interconnect PCBs) which creates a structure that enables even more complex interconnections. HDI PCBs complex structures provide the necessary routing solutions for today’s large pin-count chips utilized in mobile devices and other high technology products.
It is the one which cannot fail under extreme environment and any critical applications this high-reliability PCBs are increasingly demanding the application today that required the PCB that cannot fail under use. Conventional PCB can be any layer count, but rely on conventional drilling and plating technology.
Our Capability includes:
- Multilayer up to 60+ layers.
- Wide range of laminate options including high temperature low Loss and Lead-free laminates.
- Mixed Dielectric and hybrid constructions.
- Embedded coin, or metal core and metal backed Multilayer boards.
- Panel size up to “30×55”.
Advanced Capabilities: Microvias
Get an Instant quote for HDI PCB