HDI(High-Density Interconnect PCBs)

HDI PCB Manufacturing Company In India

Leading HDI PCB Manufacturing Company in India

Cerra Systems is one of the Leading HDI PCB Manufacturing Company In India . We provide quality HDI PCB at a reasonable cost. Cerra Systems has a highly skilled team which has years of experience in HDI PCB Manufacturing. We offer our clients a wide range of HDI PCBs that are manufactured using high quality raw material and components. These HDI PCBs are available in different sizes and specifications as per the requirements of our clients. We also offer customization facility to our clients as per their specific requirements.

HDI PCB (High-Density Interconnect PCBs)

HDI PCB is helpful and one of the latest technologies available to increase the functionality of PCB using the same or less amount of area. This advanced technology in PCB has driven the miniaturisation of components and semiconductor packages that supports advanced features in new products. This includes touch screen computing 5G network communications and Military Applications, Automotive, Medical PCB Manufacturing.

HDI Printed circuit Boards are characterised by high-density attributes fine line and high-performance thin materials including laser lines. This increased density enables more functions per unit area. HDI PCB have multiple layers of copper filled stacked microvias and (Advanced High-Density Interconnect PCBs) which creates a structure that enables even more complex interconnections. HDI PCBs complex structures provide the necessary routing solutions for today’s large pin-count chips utilised in mobile devices and other high technology products.

It is the one which cannot fail under extreme environment and any critical applications this high-reliability PCBs are increasingly demanding the application today that required the PCB that cannot fail under use. Conventional PCB can be any layer count, but rely on conventional drilling and plating technology.

HDI Structures:

  • 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
  • i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
  • Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices
Deep Stacked Microvias

Stacked Microvias

Deep Microvias

Deep Microvias

Stacked Microvias

Deep Stacked Microvias

NextGen-Stacked Microvias

NextGen-Stacked Microvias

10L “any layer” X-section

10L “any layer” X-section

Typical HDI Board for mobile devices

Typical HDI Board For Mobile Devices

PCB Manufacturing Capability Includes:

  • Multilayer up to 60+ layer

  • Wide range of laminate options including high temperature, low loss and lead-free laminates

  • Mixed dielectric (hybrid) constructions
  • Panel size up to 30″x 55″
  • Embedded coin, or metal core and metal backed MLB
  • Panel thickness up to .450″
  • RF and microwave circuits
  • Heavy copper (10 oz. outer layer / 5 oz. inner layer)
  • Embedded, distributed and discrete passive components.
 
HDI-PCB-1
HDI PCB-2
HDI-pcb3

Advanced Capabilities: Microvias

A laser-drilled microvias has a drilled diameter as small as 0.004″ (100µm), which is optically aligned in a pad diameter as small as 0.008″ (200µm), allowing additional routing density. Microvias can be via-in-pad (for direct component mounting), offset, staggered, or stacked, non-conductive filled, and copper-plated over the top or solid copper filled or plated. Microvias add values when routing out of fine pitch BGA such as 0.8 mm pitch devices and below.

Additionally, microvias add values when routing out of a 0.5 mm pitch device where staggered microvias can be used. However, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device requires stacked microvias using an inverted pyramid routing technique.

We have years of experience with HDI PCB products and was a pioneer of second-generation microvias or stacked microvias. Stacked microvia technology with solid copper stacked microvias enables rout-out solutions for very high speed and micro BGA. Cerra Systems offers an entire family of microvia technology solutions for your next-generation products.

Why Do You Choose Our HDI PCB?

Our staff constantly strives to fulfil our clients’ expectations for quality in order to provide superior HDI PCB products and services. Our business is outfitted with cutting-edge equipment that enables us to offer HDI PCB Products that meet international quality standards.

Our skilled engineers and staff at India Cerra Systems enable us to achieve the highest degree of client satisfaction. We can confidently declare that we have risen to the position of top HDI PCB manufactures in India thanks to customer satisfaction.

If you plan to build your first HDI PCB and are choosing hardware for it, we are here to assist you in doing so quickly. We offer HDI PCB prototype and SMT assembly services at Cerra Systems. We are constantly exploring for new approaches to enhance the HDI PCB manufacturing process and fulfil the needs.

Cerra Systems is a globally recognized PCB Manufacturing company in India supporting the Fabrication of Printed Circuit Boards (PCB)  for Its Global Clients as per Automotive (IATF 16949), Medical Devices (ISO 13485), Aerospace & Defense (AS9100D, MIL-PRF, LCSO) quality management standards.

PCB Products​

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