IPC Classifications For Rigid PCBs
The Institute for Interconnecting and Packaging Electronic Circuits (IPC)
IPC 6011/6012 Circuit Classifications (Rigid Circuits)
Type 1
• Single-Sided
Type 2
• Double-Sided
Type 3
• Multilayer without blind or buried vias
Type 4
• Multilayer with blind and / or buried vias
Type 5
• Metal core Multilayer without blind or buried vias
Type 6
• Metal core Multilayer with blind and / or buried vias
IPC Classifications For HDI PCBs
The Institute for Interconnecting and Packaging Electronic Circuits (IPC)
IPC 2226A Classification of HDI Types
Type 1
• 1 [C] 0 or 1 [C] 1 – with through vias connecting the outer layers
Type 2
• 1 [C] 0 or 1 [C] 1 – with buried vias in the core and may have through vias
connecting the outer layers
Type 3
• ≥ 2 [C] ≥ 0 – may have buried vias in the core and may have through vias
connecting the outer layers
Type 4
• ≥ 1 [P] ≥ 0 – where P is a passive substrate with no electrical connection
Type 5
• Coreless constructions using layer pairs
Type 6
• Alternate constructions
How Are Printed Circuits
Fabricated ?
The following is outline of the manufacturing process to produce a 8
layer IPC Type II HDI printed circuit
Sales and Account Management
It all starts with the sales organization !
Basic Process Flow
Manufacturing Instructions (MI)
- Analyze data (gerber file, drawings, netlist, etc.)
- Raise issues in TQ and confirm with customer
- Create Manufacturing Instructions and CAM
Instructions
CAD/CAM
- Panelize Customer data (step and repeat
data on a panel) - Add test / TDR coupons & tooling locations
- Create Drill files, Layer files, Rout files,
Electrical test data, etc. - CAD Reference files (each layer) for AOI
Panelization
1+6+1 HDI
Epoxy-Glass Laminate Construction
- Dielectric constant of the composite laminate
is a function of the resin/glass ratio - Composite laminates can have many different
resin/glass constructions - Heavy glass fabric can have fiber bundles that are Larger than the actual copper trace
Inner Layer
Pressing (Lamination)
Inner Layer (Sub-Assembly)
Inner Layer (Sub-Assembly) -> Outer Layer
Outer Layer
Cerra Systems is one of the leading PCB manufacturing solutions providers with PCB manufacturing plants located in North America, Asia with certifications for MIL, AS, TS, ISO, & NADCAP. Our products are Rigid, Flex, Rigid-flex, HDI, RF, and hybrid PCBs addressing up to 64 layers and 2 mil technology. Cerra Systems Major PCB Market is Aerospace, defense, Medical, computing, cellular & Industrial. Microvias PCB in India
For more information, visit- http://cerrasystems.com/pcb-fabrication/
Manufacturing Partners Profile includes:
Argus Sytems (AESPL) – PCBA, Cable Assembly, Box Build.
Emsxchange – PCBA, Cable Assembly, Box Build.
