PCB Fabrication Process

PCB Fabrication

IPC Classifications For Rigid PCBs

 

The Institute for Interconnecting and Packaging Electronic Circuits (IPC)
IPC 6011/6012 Circuit Classifications (Rigid Circuits)

Type 1
• Single-Sided

Type 2
• Double-Sided

Type 3
• Multilayer without blind or buried vias

Type 4
• Multilayer with blind and / or buried vias

Type 5
• Metal core Multilayer without blind or buried vias

Type 6
• Metal core Multilayer with blind and / or buried vias

IPC Classifications For HDI PCBs

 

The Institute for Interconnecting and Packaging Electronic Circuits (IPC)
IPC 2226A Classification of HDI Types

Type 1
• 1 [C] 0 or 1 [C] 1 – with through vias connecting the outer layers

Type 2
• 1 [C] 0 or 1 [C] 1 – with buried vias in the core and may have through vias
connecting the outer layers

Type 3
• ≥ 2 [C] ≥ 0 – may have buried vias in the core and may have through vias
connecting the outer layers

Type 4
• ≥ 1 [P] ≥ 0 – where P is a passive substrate with no electrical connection

Type 5
• Coreless constructions using layer pairs

Type 6
• Alternate constructions

How Are Printed Circuits
Fabricated ?

 

The following is outline of the manufacturing process to produce a 8
layer IPC Type II HDI printed circuit

Sales and Account Management

 

It all starts with the sales organization !

Sales and Account Management

Basic Process Flow

Basic Process Flow

Manufacturing Instructions (MI)

  • Analyze data (gerber file, drawings, netlist, etc.)
  • Raise issues in TQ and confirm with customer
  • Create Manufacturing Instructions and CAM
    Instructions

CAD/CAM

 
  • Panelize Customer data (step and repeat
    data on a panel)
  • Add test / TDR coupons & tooling locations
  • Create Drill files, Layer files, Rout files,
    Electrical test data, etc.
  • CAD Reference files (each layer) for AOI
 

Panelization 

Panelization

1+6+1 HDI

HDI PCB

Epoxy-Glass Laminate Construction

Epoxy Glass Laminate Construction
  • Dielectric constant of the composite laminate
    is a function of the resin/glass ratio
  • Composite laminates can have many different
    resin/glass constructions
  • Heavy glass fabric can have fiber bundles that  are Larger than the actual copper trace
 

Inner Layer

PCB Inner Layer
Inner Layer

Pressing (Lamination)

Lamiation

Inner Layer (Sub-Assembly)

Sub Assembly Inner Layer
Inner Layer Sub Assembly

Inner Layer (Sub-Assembly) -> Outer Layer

Outer Layer

Outer Layer

Sub Assembly Outer Layer
Outer Layer Sub Assembly
Sub-Assembly Outer Layer
Outer Layer Sub-Assembly

Cerra Systems is one of the leading PCB manufacturing solutions providers with PCB manufacturing plants located in North America, Asia with certifications for MIL, AS, TS, ISO, & NADCAP. Our products are Rigid, Flex, Rigid-flex, HDI, RF, and hybrid PCBs addressing up to 64 layers and 2 mil technology. Cerra Systems  Major  PCB Market is Aerospace, defense, Medical, computing, cellular & Industrial. Microvias PCB in India

For more information, visit- http://cerrasystems.com/pcb-fabrication/