PCB Material Selection, PCB Fabricator in India

PCB Material Selection

PCB Material Selection | PCB Fabricator in India

  • What material is best for a design?
    • Signal integrity performance (signal speed and signal loss) is often the driving factor in going to a higher cost material set
    • Other factors include
      • Thermal performance
      • Ability to assemble and rework
      • Long term reliability
  • Going to a ‘higher speed’ material provides improved signal loss (attenuation), but trace lengths also play a major role in determining loss characteristics
    • Normally, once speeds of 3Gbps (1.5GHz) are employed, higher speed materials should be considered
    • Signal loss on shorter traces is less, and standard high-Tg FR4 can therefore be used at speeds as high as 10Gbps as long as the trace lengths are short enough (a good rule of thumb is 4” or less)
• Material build options
– Full build with desired high-speed material
  • Although this will provide superior performance, it will also be the most expensive option and should be used when all PCB layers require improved signal performance
– Hybrid builds
  • Often, high-speed signals can fit on just a few of the layers within the build
  • Utilizing high-speed materials on either one or both external layers (with standard FR4 on the remaining layers) will provide a desirable performance/cost-benefit
  • Utilizing lower cost cores where high-speed isn’t required can also provide lower material costs
    • NOTE: Avoid mixing different material prepregs
  • Hybrid builds can use a core construction (cores on external dielectrics) in order to maximize dielectric thickness consistency
• Mixed Materials In
  • When using a mixed material build, consider the effects of warpage due to the mixing of materials, and take steps to eliminate it
  • PWB costs may increase, but the build will be more robust
  • Avoid mixing different prepreg materials in the same stack up
  • Different prepregs require different press cycles and this cannot be done unless the build is converted to a sequential lamination
  • Mixing cores is OK as the cores are already fully cured
• Reliability Cost
• IPC6012 Class 2 vs. Class 3/3A/DS – 10-20% cost adder
  • The vast majority of PCB outside of A&D are IPC Class-2
  • IPC Class 2 requires cross-sections performed on a sample basis per customer

Most customers don’t request sections

  • IPC Class 3/3A/DS requires cross-sections to be done on 100% of the manufacturing

The cost impact is as follows

  • Greatly increased lab time for sectioning and report creation
  • Coupons must be removed, documented, and stored (up to 20 yrs for some customers)
  • More coupons are required for Class 3 products than Class 2, due to sectioning and retention requirements. PCB number up and panelization can be affected
  • IPC Class 3/3A/DS requires some special process steps that consume production time and resources
    • All panels are serialized to ensure full traceability
    • Plating times are 25%-50% longer (1 mil or 1.5mil min vs. 0.8 mil min)
    • Additional in-process micro-sectioning is completed in order to ensure compliance with Class 3 requirements for copper and annular ring
  • IPC Class 3A requires additional testing (fungus resistance, MIR, rework simulation, ) for which further cost adders apply

As an established PCB Fabricator Supplier in India with an in-depth understanding of the Printed Circuit Board domain including a complete product design life cycle. We have the competence to offer you the finest quality boards within the specification and quantities that you desire.

For more details, visit us;- http://cerrasystems.com/pcb-fabrication/

Manufacturing Partners Profile includes: 
Argus Sytems (AESPL) –  PCBACable AssemblyBox Build
Emsxchange – PCBA, Cable Assembly, Box Build.

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